Thermal conductive silicone gel (development product)
Soft, strong, and connects heat. Next-generation electronics encapsulation material.
BD-4747 thermal conductive silicone gel is a two-component, addition reaction type silicone sealant that achieves a high level of "flexibility," "reliability," and "thermal control performance" required for next-generation electronic devices. Its low viscosity design provides excellent flowability and self-leveling properties, allowing it to smoothly penetrate fine gaps and cure uniformly while suppressing bubble formation. It is compatible with both room temperature and heat curing, enabling flexible adjustment of working time. After curing, it retains a soft, adhesive gel-like consistency and adheres widely to resin materials such as PC and ABS, as well as metal surfaces. Furthermore, it boasts a thermal conductivity of 0.7 to 0.8 W/m·K and flame retardancy compliant with UL 94V-0, along with excellent electrical insulation, waterproofing, heat and cold resistance, and weather resistance. It is also compliant with RoHS and REACH, making it an environmentally conscious development product. Applications include thermal control and sealing for power modules, IC chips, LED assemblies, solar power connection boxes, and automotive electronic components. It demonstrates its capabilities in environments that demand cutting-edge reliability.
- Company：ロイアルブリッジ
- Price：Less than 10,000 yen
